Microlayer coextrusion of electrical end products

ABSTRACT

A method and system for extruding multiple laminated flow streams using microlayer extrusion, and in particular to creating and forming products with electrical properties that are formed from layers and particles with dimensions in the micro to nanometer range.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of, claims priority to and thebenefit of U.S. patent application Ser. No. 16/684,708 filed on Nov. 15,2019, which, in turn is a continuation of U.S. patent application Ser.No. 16/030,164 filed on Jul. 9, 2016, now U.S. Pat. No. 10,479,045,which, in turn is a continuation of U.S. patent application Ser. No.13/916,551 filed on Jun. 12, 2013, now U.S. Pat. No. 10,035,322, whichclaims priority to and the benefit of U.S. Provisional PatentApplication No. 61/658,743 filed on Jun. 12, 2012, the disclosures ofwhich are incorporated herein by reference in their entireties.

FIELD

The aspects of the disclosed embodiments thereof generally relate tomicrolayer extrusion of flow streams with electrical propertiesincluding dies, products and methods of preparing these flow streamswith electrical properties. More specifically, these dies and flowstreams can form layers that may be optionally deposited sequentially toform layer by layer products. These flow streams may also form multiplelaminated flow streams in which certain streams comprise electricalproperties. These flow streams may also be folded so as to formcontinuous layers containing folds or pores. More specifically, theseflow streams may create and form products with electrical propertiescomprising layers and particles with dimensions in the micro tonanometer range.

BACKGROUND

Continuous layer-multiplying coextrusion processing of metal-filledpolymers into conducting structures has been described in “Polymermicrolayer structures with anisotropic conductivity,” S. Nazarenko, A.Hiltner and E. Baer, Department of Macromolecular Science, and Centerfor Applied Polymer Research, Case Western Reserve University,Cleveland, Ohio 44106-7202, Journal of Materials Science, 34 (1999)1461-1470 (Kluwer Academic Publishers), the disclosure of which isincorporated herein by reference in its entirety. In this process,filled and unfilled polymers are combined into unique structures withmany alternating layers of two or more components. The total number oflayers can range from tens to thousands. The ability of microlayering to“organize” anisotropic particles was used to obtain metal-filledpolypropylene tape with highly anisotropic electrical properties.Orientation of metal flakes by microlayering increased the anisotropy inresistivity by two orders of magnitude over compression molding.Isolation of individual filled layers by alternating filled and unfilledlayers resulted in materials with many independent conducting pathways.Filled layers with 10% (v/v) copper flakes or 15% (v/v) nickel flakeswere conductive only if the filled layers were thick compared to thethickness of the flake particles. When the thickness of the filledlayers approached the particle thickness, the conductive properties werelost. This behavior was understood by comparing the three-dimensionalarrangement of flakes in thick conductive layers with thetwo-dimensional particle layout of thin non-conductive layers.

General principles regarding the methods and extrusion dies that can beadapted to form the microlayer electrical conducting extrusions inproducts layer by layer as well as dies in which the layers are createdthrough folding may be found in United States Patent Publication No.2012/0189789 “Method and Apparatus for Forming High Strength Products”and in U.S. Pat. No. 7,690,908 issued Apr. 6, 2010 referring to foldedflows with nanofeatures. Other methods are described in U.S. Pat. Nos.6,669,458, 6,533,565 and 6,945,764. Each of the aforesaid publication orpatent is herein incorporated by reference in its entirety.

In one specific microlayer extrusion process, each of the laminated flowstreams is subject to repeated steps in which the flows are divided andoverlapped to amplify the number of laminations. The amplified laminatedflows are rejoined to forma cumulated laminated output which can achievedimensions as thin as the micro or nanometer range. One example of adevice that can be used in a microlayer extrusion process to create alaminated output is US Patent Publication 2012/0189789, filed on Dec.23, 2011, entitled Method and Apparatus for Forming High StrengthProducts, the disclosure of which is incorporated herein by reference inits entirety. This nano-flow die device (referred to herein as the“nano-flow die”) can be used to create layers in a multi-layered productthat have at least one dimension in the nanometer range.

SUMMARY

The aspects of the disclosed embodiments are directed to extrusionproducts possessing electrical properties. More specifically, theseextrusion products contain thin layer(s) (milli, micro or nano) whereinone or more layers contain electrical conducting materials and morespecifically nanoparticle electrical conducting materials. Aspects ofthe disclosed embodiments are also directed to creating and producingnanoparticle products using microlayers to enhance the electricalproperties of the products. In one embodiment, each layer may becomprised of one or more elements that facilitate one or more of thelayers to conduct electricity.

A specific embodiment relates to an extruded thin layer polymer productcomprising one or more layers possessing electrical properties. A morespecific embodiment relates to a product wherein said one or more layersare milli, micro or nano size, wherein said one or more layers containnanoparticle electrical conducting materials. More specifically whereinsaid product wherein said one or more electrical conducting layers arelayered between nonconducting layers.

Another embodiment relates to a product, wherein at least one layercontaining a conducting material is between 20 nm to 500 μm, morespecifically 20 nm to 100 μm. Other embodiments are between 20 to 500nm. Other dimensions of interest include: between 20 to 250 nm andbetween 50 to 250 nm.

The electrical conducting material also has specific dimensions ofinterest. Some particles may be 100 μm in at least one dimension. Otherparticles may be 1 μm in at least one dimension. Other particleembodiments may be in the nano dimension such as 500 nm, 250 nm, 100 nm,10 nm or 1 nm.

Another embodiment relates to a method of preparing multilayerelectrical conducting extrusions, comprising: receiving a flow ofextrudible material in an extrusion system and constructing a series ofribbon shaped flow streams wherein at least one of the streams comprisesconducting particles; subjecting the ribbon shaped flow streams tomultiple sequences of stages, wherein, in each of said sequences theflow streams are compressed, said sequences further comprising: joiningsets of the series of ribbon shaped flow streams to form multiplelaminated flow streams flowing in parallel; dividing each of themultiple parallel laminated flow streams into at least two adjacent flowstreams, while compressing the resulting flow streams to form thinnerlaminations; overlapping the adjacent flow streams to form a flowstream, thereby multiplying the number of laminations; repeating thedividing and overlapping steps in parallel for each of the multipleparallel laminated flow streams to multiply the number of laminationsand to generate progressively thinner laminations until at least oneelectrical conducting layer is obtained.

Another embodiment relates to a method, wherein the multiple laminatedflow streams are combined to form a single output laminated flow streamwherein at least one of the layers has a thickness of 100 μm to 10 nm,100 μm to 1 μm, or 1 μm to 25 nm.

Another embodiment relates to a method wherein the laminated flow streamhaving electrical conducting properties is introduced to an extrusiondie having rotating components to wind the laminated flow to form atubular product.

Another embodiment relates to a method wherein the received flow ofextrudible material is first divided into multiple balanced capillaryflow streams.

Another embodiment relates to an extrusion system comprising: a firststage of die plates constructed to receive a flow of extrudible materialand divide said flow into multiple ribbon shaped flow streams; a secondstage of die plates constructed to receive the multiple ribbon shapedflow streams and further divide each of said multiple ribbon shaped flowstreams into at least two ribbon shaped flow streams and further saidsecond stage of die plates constructed to layer said at least two ribbonshaped flow streams into composite laminated flow streams; and a thirdstage of die plates constructed to receive the composite laminated flowstreams and to again divide each of said composite laminated flowstreams into at least two ribbon shaped flow streams and further saidthird stage of die plates constructed to layer said at least two ribbonshaped flow streams into composite laminated flow streams, wherein thenumber of laminations is multiplied and compressed.

Another embodiment relates to an extrusion system, wherein the multipleflow streams from the first stage of die plates are displaced in a stackto create multiple flow streams flowing in parallel.

Another embodiment relates to an extrusion system, wherein the dividedflow streams of the second and third stages of die plates are displacedtransversely to the stack to create side by side flow streams forlayering into laminations.

Another embodiment relates to an extrusion system, further comprising adistribution stage of die plates constructed upstream of the firststage, said die plates in said distribution stage constructed to receivethe flow of extrudible material and divide said flow of extrudiblematerial into a balanced flow of capillary flow streams for delivery tosaid first stage of die plates.

Another embodiment relates to an extrusion system comprising: adistribution die module constructed to receive a flow of extrudiblematerial and divide said flow into multiple capillary streams at adownstream outlet of the distribution die module; a first transition diemodule constructed to receive the multiple capillary streams from thedistribution die module and transform the capillary streams intomultiple ribbon shaped streams, expanded in number by a predeterminedfactor and reduced in cross sectional flow area, at the outlet of thefirst transition die module; a second transition die module constructedto receive the multiple ribbon streams from the first transition diemodule, to layer said multiple ribbon streams into one or more laminatedstreams, and to divide each of the multiple laminated ribbon streamsinto at least two sets of multiple ribbon streams at the outlet of thesecond transition die module; a third transition die module constructedto receive the at least two sets of multiple laminated ribbon streamsfrom the second transition die module and to further layer the multiplelaminated ribbon streams to increase the number of laminations of eachribbon stream and to combine said further layered laminated ribbonstreams into a reduced number of laminated streams at the output of thethird transition die module; a final die module constructed to receivethe reduced number of multiple laminated streams from the thirdtransition module and to subject said multiple laminated streams tofurther dividing and layering to multiply the number of laminations ineach of the multiple laminated ribbon streams to form multiple laminatedribbon streams having a laminated structure with increasing numbers ofthinner and thinner laminations to form an extruded material havingmilli, micro or nano-sized features.

Another embodiment relates to an extrusion system wherein thedistribution die module includes a first distribution die havingmultiple distribution grooves to provide a balanced flow into multiplecapillary outlets.

Another embodiment relates to an extrusion system wherein the outlet ofthe first transition die module is constructed having a substantiallyrectangular cross section to convert the capillary flow to a ribbonflow.

Another embodiment relates to an extrusion system wherein thedistribution die module, the first, second and third transition diemodules and the final die modules are arranged to process the flow ofextrudible material in parallel flow streams.

Another embodiment relates to an extrusion system further comprising anoutput die module that combines the multiple laminated ribbon streamsinto a single output laminated stream having nano-sized features.

Another embodiment relates to a method, comprising: extruding a flow ofextrusion material containing electrical conducting particles in anon-rotating extrusion assembly; forming a first set of multiplelaminated flow streams from the extruded flow; amplifying a number ofthe laminations by repeatedly compressing, dividing and overlapping themultiple laminated flow streams; rejoining the parallel amplifiedlaminated flows; forming a first combined laminate output withnano-sized features from the rejoining; and forming a tubular shapedmicro-layer electrical conducting product from the combined laminateoutput. Another embodiment relates to said method, wherein forming thetubular shaped micro-layer electrical conducting product comprises:introducing the combined laminate output containing electricalconducting particles into an exit flow passage of then non-rotatingextrusion assembly, the exit flow passage being skewed from a paralleldirection of the flow stream at a pre-determined helical pitch anglerelative to a central axis of the non-rotating extrusion assembly; andbonding the ends of the combined laminate output.

Another embodiment of the present disclosure relates to taking anon-conductive material, such as a polymer, and creating an electricallyconductive product in the die, including milli, micro or nano-flow dies,using the polymer. In one embodiment, making an electrically conductiveproduct using the polymer comprises filling the polymer with aconducting material such as a metal. The term “filling” is generallyused to define a state where there are sufficient conductive particleswithin the product or layer to establish a conductive state. As willgenerally be understood in the art, this can include a product layerthat only partially comprises conductive elements or particles. Inalternate embodiments, any suitable material that enables or providesfor electrical conductivity can be used to create an electricallyconductive product using the polymer, such as metals, graphite,synthetic organic and organometallic threads (polyacetylene,polypyrrole, and polyaniline) and their copolymers, Poly(p-phenylenevinylene) (PPV) and its soluble derivatives and poly(3-alkylthiophenes).

Polymers, such as polymer nanocomposites (PNC) are polymers orcopolymers containing dispersed nanoparticles. Nanoparticles, as thatterm is used herein, generally refers to particles having at least onedimension in the nanometer range, such as less than 100 nanometers. Thedie devices, such as milli, micro or nano-flow die devices, referred toabove can also use polymers that have nanosized particles in thecreations of such products and may possess electrical propertiesparticularly as they reach a certain alignment density in the extrusionstream.

Polymers may also in certain situations include micrometer particles andparticles with electrical properties. One specific particle may have onedimension less than 250 microns.

If one were to use a polymer nanocomposite in a die, such as a milli,micro or nano-flow die referred to above, and look at the layers under amicroscope, a single layer produced by the die can have a designedthickness down from millimeter through micro to nanometer thicknesses,such as 100 μm, 10 μm, including nano thicknesses (when the nano-flowdie is used) such as for example of approximately 250 nm. In alternateembodiments, the layer can be any suitable size, other than including250 nm. Inside that layer, there can also be particles that couldmeasure for example approximately 15 nm.

The number of microlayers that can be applied to a product incorporatingaspects of the disclosed embodiments is not limited. The number oflayers, or microlayers in a product produced by the die, includingmilli, micro or nanoflow die devices, of the disclosed embodiments canrange in number from the tens to thousands.

It is generally understood that the conducting materials, such as metalparticles, can be organized, such as in one or more of the layers in amicrolayer structure. In such a layered structure, this organization orstructure can also be applied to other particles as well in order to,for example, enhance the tensile properties of the structure so thestructure can span greater distances under its own weight (i.e. tensilestrength enhancing non-conductive particles in the in the insulatinglayer).

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIG. 1 illustrates a solid rod of annular conductive microlayers.

FIG. 2 illustrates a solid rod with alternating layers of annularnon-conductive and conductive microlayers.

FIG. 3 illustrates an elliptical version of the embodiments shown inFIGS. 1 and 2.

FIG. 4 illustrates one embodiment of an annular conductive microlayeredcable that includes a hollow center.

FIG. 5 illustrates one embodiment of micro-layer structure that includesan annular non-conductive microlayered structure around a conductivemicrolayered rod.

FIG. 6 illustrates an embodiment of a micro-layer that includes multiplestreams of conductive layers separated by non-conductive material.

FIG. 7 illustrates an embodiment of a micro-layer structure thatincludes annular repeating matrix/fiber or mats around a conductivemicrolayered rod.

FIG. 8 illustrates a regular layered composite material structure.

FIG. 9 illustrates one embodiment of a nano layered matrix.

FIG. 10 illustrates one embodiment of micro-layer nano-structure thatincludes an annular conductive microlayered structure around asubstrate.

FIG. 11 illustrates a superconducting cable with superconducting tapeswound around a multistrand copper core.

DETAILED DESCRIPTION

Interest in conductive plastics has been stimulated by the numerousopportunities afforded by the rapidly developing electronics industry,particularly for EMI shielding, in low temperature heaters, and astransducers. Although most polymers are insulators, conductiveproperties can be achieved by blending with conducting materials such asa metal filler. Metal-filled polymers undergo a sharp transition from aninsulator to a conductor at a critical filler concentration. The sharpchange is due to the formation of a network among the conducting fillerparticles. This network does not necessarily imply physical contactbetween adjacent particles; hopping or tunneling, i.e. the processes bywhich an electron jumps across an insulator gap, can also produce thenetwork. Network formation is frequently treated as a percolationprocess.

Geometric constraints imposed by layer multiplying may produce verystrong shear stresses which, in turn, facilitate particle orientation inthe plane of the extruded layers.

In another embodiment, micro-layer products such as those mentionedherein that do not use a substrate can be taken from pellet form to afinished product in a single extrusion operation. This advantageouslydrastically reduces production costs. This is especially true forsemiconductor applications.

Examples of products that can be manufactured as micro-layer products,as generally described herein, using a nano-layer device for example,can include, but are not limited to, conductive composite nano-materialsthat provide a resistance to Electro-Static Discharges (ESD) such aslightning strikes or Electromagnetic Pulse (EMP), High Power Microwave(HPM) attacks, as well as management of natural and man-madeElectromagnetic Interference (EMI).

An additional advantage of micro-layer products incorporating aspects ofthe disclosed embodiments is that the reduction of metal can reduceweight. An electrically conducting product creating using nanolayers canreduce the amount of metal required to maintain the desired degree ofelectrical continuity. This is advantageous when creating products thatbenefit from lighter weight materials.

Other examples of various products that can be produced using thenanoflow device of the disclosed embodiments are illustrated anddescribed below.

FIG. 1 illustrates a solid rod of annular conductive microlayers, whileFIG. 2 illustrates a solid rod with alternating layers of annularnon-conductive and conductive microlayers.

FIG. 3 illustrates an elliptical version of the embodiments shown inFIGS. 1 and 2. In alternate embodiments, the rod structure could also bein the form of a square, a special profile or other suitable geometricshape. The extruded material may also have a corrugated shape. Spiraland helical shapes are also possible.

FIG. 4 illustrates one embodiment of an annular conductive microlayeredcable that includes a hollow center.

A typical wire may be covered with one or more layers of a nonconductive insulator and have a solid core, similar to that shown inFIG. 1. In the example of FIG. 4, the wire is an annular conductivemicro-layered tube and it is covered with non-conductive layers.Applications of such a wire include, but are not limited to, heating afluid, a superconductor (with a gas or fluid passing thru the core orhollow center), replacement for a conventional wire, and making aparison for a blow molded product.

FIG. 5 illustrates one embodiment of micro-layer structure that includesan annular non-conductive microlayered structure around a conductivemicrolayered rod.

A typical wire will be covered with one or more layers of a nonconductive insulator such as that shown in FIG. 1. In the example ofFIG. 5, the wire is a conductive microlayered rod and it is covered withnon-conductive microlayers. Applications for the structure shown in FIG.5 can include, but are not limited to superconductors and replacement ofa conventional wire.

FIG. 6 illustrates an embodiment of a micro-layer that includes multiplestreams of conductive layers separated by non-conductive material. Eachstream can serve as its own conductive pathway which would be analagousto eight separate wires. Other embodiments could include any number andarrangements of separated layers.

FIG. 7 illustrates an embodiment of a micro-layer structure thatincludes annular repeating matrix/fiber or mats around a conductivemicrolayered rod. The matrix can also be extruded.

FIG. 8 illustrates a regular layered composite material structure.

FIG. 9 illustrates one embodiment of a nano layered matrix

As is shown in FIG. 8, normally a composite material structure is madewith multiple layers of weaved fibers embedded in a polymer matrix. Thematrix is applied onto a layer of woven fiber and another ply of fiberis added on. The process is repeated until the desired number of plys isreached. However, as is shown in FIG. 9, rather than simply coating thefibers in the matrix, the polymer matrix can be extruded onto the carbonfiber weave with internal nano layer matrix between two layers of purepolymer matrix. The pure matrix layers may not be necessary if therearen't large additives or if the additives do not negatively impactadhesion between the matrix and the fibers. These nano layers may allowthe use of metallic flakes as an additive to create a conductive layer.There is the potential to mix and match other additives to create otherbarrier properties as well. This can be done in the same nanolayers orseparate nanolayers.

Applications of the structure shown in FIG. 9, can include, but are notlimited to hollow or solid structural components for conductingelectricity and/or heating a fluid or superconductor (with a gas orfluid passing thru the core).

FIG. 10 illustrates one embodiment of micro-layer nano-structure thatincludes an annular conductive microlayered structure around asubstrate. Applications of the structure can include, but are notlimited to superconductor applications.

Alternatively, the structure can include an annular non-conductivemicrolayered structure around a substrate. Applications of such astructure can include an insulator.

In one embodiment, the aspects of the present disclosure relate toextruding superconducting tapes that are wound around a multistrandcopper core of a superconducting cable, such as that shown in FIG. 11.The superconducting tapes can be manufactured using the nanoflow deviceof the disclosed embodiments, which greatly simplifies the manufacturingprocess. United States Patent Publication 2010/0197505 describes certaintape extrusions but has limited utility due to the very elaboratemanufacturing process (see page 4). The aspects of the disclosedembodiments provide for producing far greater amount of tapes, over athousand, for example in a much simpler process.

In another embodiment, the shape of the tapes can be extruded in asubstantially straight form. In alternate embodiments, the extrudedshape of the tapes can be twisted, such as when using the rotary head ofU.S. Pat. No. 6,447,279, or twist the tapes such as United States PatentPublications 2010/0197505 and US2005/0181954. In United States PatentPublication No. 2010/0197505 (page 2, paragraphs 0021 and 0024) there ismention of reducing tape widths to change the effect of hystereticlosses. The die device, including milli, micro, or nanoflow die devices,referred to herein can be configured to create a large number of arrayedmelt streams or “tapes”, reducing the “tapes” width.

In accordance with aspects of the disclosed embodiments, the coating ofthe central “cable” could all be done in a single extrusion process.

The current state of the art has limitations in flexibility because thearray of rigid metal tapes restrict movement. There is also potentialfor those tapes to permanently kink when bent.

The aspects of the disclosed embodiments include themanufacturing(extrusion) process for making such a product withconductive microlayers

In another embodiment, layers can be extruded between the superconductor“tapes” to minimize AC losses or the tapes can be extruded to makedirect (electrical) contact with each other.

The central core can be made of a conductive metal or other material.

Another embodiment of alternating conductive and non-conductive layersis a capacitor where the conductive layers will hold a charge and thenon conductive layers will serve as a separator/dielectric.

Other applications can include, but are not limited to conductingpolymers for use in lithium ion batteries and nanocellulose products,such as electronic and medical products. In a lithium ion battery, themain parts includes a Positive Electrode (Cathode), a Negative Electrode(Anode), a separator and a Liquid Electrolyte (typical Li battery) orSolid polymer composite electrolyte (Li-Ion Polymer Battery).

The anode in Li-Ion polymer Battery is typically made from graphite.Silicon can store 10 x more lithium ions than graphite, but swells morethan 3× its volume when fully charged, which breaks electrical contacts.Silicon nano-powder in a conductive polymer binder or a polymer binderwith carbon black for conductivity is used to decrease swelling.Swelling of silicon is still problematic in that repeated swelling andshrinking of the silicon particles push away the carbon black particles.

The use of conductive polymers would allow the anode material to beextruded. Polymers such as polyaniline (PAN) or preferably the polymermentioned in<http://www.onlinetes.com/tes0312-lithium-ion-battery-anodes.aspx> couldbe used. In one embodiment, the outer cathode layer, with an extrudedinner hollow or solid anode layer can be formed using a conductivepolymer. The electrodes can be separated by an extruded layeredseparator, referred to as a battery separator, described below. Thecathode could be extruded as an outer layer or deposited through othermeans, such as CVD or PVD, for example.

The battery separator is a porous sheet placed between the positive andnegative electrodes in a battery. Its function is to prevent physicalcontact of the positive and negative electrodes while allowing freeionic transport between them. In a Li-Ion Polymer Battery the separatorcan serve as both the electrolyte and separator between the electrodes.

Synthetic polymers including polyolefins, polyvinylidene fluoride,polytetrafluoroethylene, polyamide, polyvinyl alcohol, polyester,polyvinyl chloride, nylon, poly(ethylene terephthalate), etc. have beenused as this layer. Aspects of these polymers are referred to in anarticle Zhang, Sheng Shui (2008, July 22). BatterySeparator. SciTopics.Retrieved Jun. 7, 2012, from http://www.scitopics.com/BatterySeparator.html.

The passage of ions though the polymer separator is allowed due to poresin the material. These can be produced either through a wet or dryprocess, as they are commonly referred. The wet process allows theseparator layer to be extruded and the pores produced after extrusionthrough extraction, while in the dry process the polymer separator isstretched after extrusion to form micropores.<http://en.wikipedia.org/wiki/Polymer separators#Synthesis>. Theseparator would include a plasticizer during extrusion which would thenbe driven off to from the micropores.

The use of multilayered separators allows unique properties. A shutofflayer can be used to prevent excess temperature accumulation. The poresin this layer will close up when the layer reaches the shutofftemperature, preventing the flow of ions. An example of a co-extrudedmulti-layered battery separator is illustrated in US Patent Pub. No.20080118827, the aspects of which are incorporated herein by reference.

In one embodiment, the extruded anode layer described in paragraph 0040and the layered separator described above can be extruded onto a metalcathode wire or filament in accordance with the aspects of the disclosedembodiments. Both the outer cathode layer and extruded anode layerdescribed above, can be bundled together to form a long flexiblebattery.

Other properties that could be improved with a nano-layered batteryseparator are high temperature stability, more control over shutdowntemperature, increased puncture resistance

The aspects of the disclosed embodiments are generally directed toproducing multi-layer products using the nano-flow device described inU.S. patent application Ser. No. 13/336,825. The aspects of thedisclosed embodiments advantageously can produce electrically conductivenanolayered products in a much simpler manner, as well as microlayeredproducts including nano-sized particles that have increase strength andare lightweight. Aspects of applicable materials and polymers that canbe used in the nano-flow device have been generally described above.

1. An extruded thin multi-layer polymer product comprising tens tothousands of annular polymeric layers wherein at least one of saidannular polymeric layers includes electrical conductive particleswherein the electrical conductive particles in the at least one of saidannular polymeric layers form an electrical conducting network among theelectrical conductive particles through alignment of the electricalconductive particles wrapped around the axis of extrusion.
 2. Theextruded thin multi-layer polymer product according to claim 1 whereinthe extruded thin multi-layer polymer product is a rod.
 3. The extrudedthin multi-layer polymer product according to claim 1 wherein theextruded thin multi-layer polymer product is a tubular extruded thinmulti-layer polymer product.
 4. The extruded thin multi-layer polymerproduct according to claim 1 wherein the extruded thin multi-layerpolymer product includes a wire.
 5. The extruded thin multi-layerpolymer product according to claim 1, wherein one or more of saidannular polymeric layers are milli, micro or nano size, and wherein theat least one of said annular polymeric layers including electricalconductive particles includes electrical conductive particles that arenanoparticles.
 6. The extruded thin multi-layer polymer productaccording to claim 1, wherein the at least one of said annular polymericlayers including electrical conductive particles are layered betweennonconducting annular polymeric layers.
 7. The extruded thin multi-layerpolymer product according to claim 1, wherein the extruded thinmulti-layer polymer product is resistant to Electro-Static Discharges(ESD), Electromagnetic Pulse (EMP), High Power Microwave (HPM) attacks,and Electromagnetic Interference (EMI).
 8. The extruded thin multi-layerpolymer product according to claim 1, wherein the extruded thinmulti-layer polymer product covers a wire.
 9. The extruded thinmulti-layer polymer product according to claim 6, wherein the extrudedthin multi-layer polymer product includes a plurality of separateelectrical conducting networks.
 10. The extruded thin multi-layerpolymer product according to claim 9, wherein the plurality of separateelectrical conducting networks are along the length of extrusion. 11.The extruded thin multi-layer polymer product according to claim 9,wherein the extruded thin multi-layer polymer product includes aplurality of separate electrical conducting networks are wrapped aroundthe axis of extrusion.
 12. The extruded thin multi-layer polymer productaccording to claim 1, wherein the extruded thin multi-layer polymerproduct is a battery.
 13. The extruded thin multi-layer polymer productaccording to claim 1, wherein the extruded thin multi-layer polymerproduct is a lithium ion battery.
 14. The extruded thin multi-layerpolymer product according to claim 6, wherein the extruded thinmulti-layer polymer product comprises nonconducting annular polymericlayers including pores adjacent to the at least one of said annularpolymeric layers including electrical conductive particles.
 15. Theextruded thin multi-layer polymer product according to claim 1, whereinthe at least one of said annular polymeric layers including electricalconductive particles is between 20 nm to 100 μm thick.
 16. The extrudedthin multi-layer polymer product according to claim 1, wherein the atleast one of said annular polymeric layers including electricalconductive particles is between 20 to 500 nm thick.
 17. The extrudedthin multi-layer polymer product according to claim 1, wherein the atleast one of said annular polymeric layers including electric conductiveparticles is between 20 to 250 nm thick.
 18. The extruded thinmulti-layer polymer product according to claim 1, wherein the at leastone of said annular polymeric layers including electrical conductiveparticles is between 50 to 250 nm thick.